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Film Formation II
Ohring: Chapter 5, sections 4-6
observe 3 growth modes experimentally1. Island growth (Volmer - Weber)

2. Layer by layer growth (Frank - van der Merwe)
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3. Mixed growth (Stranski - Krastanov)

When would we expect to see each of these ?


The layer growth condition with cosine greater than 1 looks odd. This is the case where the angle theta is undefined because for layer growth there really is no point where the substrate, vapor and film come together and therefore, no way to define the angle.
three common mechanisms:1. Ostwald ripening
- atoms leave small islands more readily than large islands
- more convex curvature => higher activity => more atoms escape
2. Sintering
- reduction of surface energy
3. Cluster migration
- small clusters (<100 Å across) move randomly
- some absorbed by larger clusters (increasing radius and height)
Further growth depends on:

Relative importance of these processes depends on
Plot these variables to find regions with similar film structure (similar properties)

See handout in class (from J. A. Thornton, J. Vac. Sci. Technol. 12 (July/Aug 1975))
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small grains, many voids |
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renucleation during growth |
mixed small and large grains, fewer voids |
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grain boundary migration |
columnar grains |
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grain boundary migration; recrystallization within grains |
large grains (sometimes columnar) |
Columnar structures

Films are typically lower density than bulk
Grain size dependence on deposition rate and substrate temperature

1. Substrate
- not really a featureless plane
- atomic structure => epitaxy
- relationship of film crystal structure to substrate crystal structure
- defects
- nucleation sites
2. Contamination
from:
- poor background pressure
- impure deposition source
- dirty substrate
changes the energies (surface energies, desorption energy, surface diffusion energy)
3. Impinging particle energy
0.5 eV -------------------> 10 - 20 eV --------> 100-1000 eVthermal evaporation ----- sputtering --------- accelerated (bias)
interactions of incident particles with film/substrate produce:
- sputter removal of surface atoms
- insertion of particles into film or substrate
- increased local temperature
- defects
- shock (pressure) waves