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Physics of Thin Films

PES 449 / PHYS 549


Arc vaporization

 


Arc vaporization process

arc vaporization deposition
  • high current, low voltage discharge
  • initiate by
    • touching electrode surfaces and then separating
    • trigger arc by high voltage breakdown
  • produces large numbers of electrons
    • very efficient ionization of film atoms (almost 100 %)
  • cool anodes to prevent deposition of anode material
  • avoid molten globules reaching film by bending ions using magnetic fields

    Source (atoms -> gas)

    • vaporization of cathode by arc
    • arc moves over cathode for uniform evaporation

    Transport

    • arc
      • many electrons between cathode and substrate
      • efficient ionization of atoms from cathode (almost 100%)
      • creates plasma region
    • ions can be accelerated toward substrate
      • energies up to 100 eV
      • may lose energy by collisions iin plasma is gas pressure is high

    Deposition

    • impinging ions may be high energy
      • enhanced chemical reactions
      • film densification
    • alloys can be deposited

    Parameters:

  • temperature
    • substrate heating and cooling
    • heating from ion bombardment
      • adjust with substrate bias
  • deposition rate
    • adjust arc current
    • adjust substrate bias to collect more ions
  • particle energy
    • adjust substrate bias

     


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